The xMEMS XMC-2400 µCooling chip is built into the silicon of microchips and can reduce the … [+]
A market leader in solid-state, microspeaker technology has announced a new form of air cooling for ultraportable electronic devices like smartphones. With powerful processors being used for intensive tasks like AI, there is a need to ensure microchips can be actively cooled.
xMEMS Labs, developers of piezoMEMS innovation and creators of all-silicon micro speakers, has announced the xMEMS XMC-2400 µCooling chip. It’s being billed as the first-ever, all-silicon, active micro-cooling fan for ultramobile devices and next-generation artificial intelligence solutions.
For the first time, with active, fan-based micro-cooling at the chip level, manufacturers can integrate this active cooling into their smartphones, tablets and other advanced mobile devices. The silent, vibration-free and solid-state xMEMS XMC-2400 µCooling chip measures just one millimeter thick.
Tiny fans built into silicon chips will keep out smartphones cool, especially when running processor … [+]
“Our revolutionary µCooling ‘fan-on-a-chip’ design comes at a critical time in mobile computing,” said Joseph Jiang, xMEMS the CEO and Co-Founder of the company. “Thermal management in ultramobile devices, which are beginning to run even more processor-intensive AI applications, is a massive challenge for manufacturers and consumers. Until XMC-2400, there’s been no active-cooling solution because the devices are so small and thin.”
The XMC-2400 measures just 9.26 x 7.6 x 1.08 millimeters and weighs less than 150 milligrams, making it 96% smaller and lighter than non-silicon-based alternatives. A single XMC-2400 chip can move up to 39 cubic centimeters of air per second with 1,000Pa of back pressure.
The all-silicon solution has the kind of reliability that semiconductors are renowned for as well as part-to-part uniformity, robustness and an IP58 rating. xMEMS µCooling is based on the same fabrication process as xMEMS Cypress full-range micro speakers for ANC in-ear wireless earbuds. xMEMS plans to sample XMC-2400 to its customers in Q1, 2025.
The xMEMS XMC-2400 µCooling chip is smaller than a dime.
“We brought MEMS micro speakers to the consumer electronics market and have shipped more than half a million speakers in the first half of 2024,” Jiang said. “With µCooling, we are changing people’s perception of thermal management. The XMC-2400 is designed to actively cool even the smallest handheld form factors, enabling the thinnest, most high-performance, AI-ready mobile devices. It’s hard to imagine tomorrow’s smartphones and other thin, performance-oriented devices without xMEMS µCooling technology.”
xMEMS will begin demonstrating XMC-2400 to its lead customers and partners in September at xMEMS Live events in Shenzhen and Taipei.
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